Semiconductor Parts Photos
Ultem machining
Stress cracking in root of fins. Poor surface finish blocks light transmitting through material.
Stress relieving of material and custom designed cutting tool eliminates machining stress. Clear finish accomplished through vapor polishing.
Ultem Plastic Assembly
ESD Ultem component requires consistent black color for optical recongnition
Turning tool testing plus tool maintenance schedule maintains black ESD color for optical readers
Ultem Machined Components
ESD Ultem component requires consistent black color for optical recongnition
ESD Ultem Plastic Fabrication Assembly
Ultem Semiconductor Comb 
Ultem Machining
24'' sq machined ultem semiconductor component. Pockets within .003 true position. Special machining cycle and packaging procedures to maintain accuracy.
Ultem Multilayer Bonded Manifold
3 layer laminate manifold in Ultem for the semiconductor industry
Ultem multilayer fluidic bonded manifold
Bonded manifold for the semiconductor industry. No feature migration or feature collapse. Bond strength equal to the parent material for a high pressure application.
Chemically polished ultem cover the semiconductor industry
Polished semiconductor cover
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