Ultem Parts Photos
Black Ultem 1000 ®
Double cam design to close tolerances (+/- .001).
Full C axis turning completes component in one setup for feature consistency. Cam profiled. Specialty tooling allows accurate formation of small features.
Ultem 1000 ®
Stress cracking in root of fins. Poor surface finish blocks light transmitting through material.
Stress relieving of material and custom designed cutting tool eliminates machining stress. Clear finish accomplished through vapor polishing.
Vapor Polishing of Ultem
Low inertia roller requires best possible finish for plating with close tolerances.
Ultem is suggested for stability and machinability. Tolerances are consistently held on ID and OD to +/- .0002 with specialty tooling. Finish measured at 15 micro inches.
20% Glass filled Ultem
Material choice creates burr and flatness problems with given part configuration.
Annealing cycle coupled with milling process maintains flatness to customer specification. Proper end mill selection eliminates burring problem.
Ultem Plastic Assembly
ESD Ultem component requires consistent black color for optical recongnition
Turning tool testing plus tool maintenance schedule maintains black ESD color for optical readers
Ultem Machined Components
ESD Ultem component requires consistent black color for optical recongnition
ESD Ultem Plastic Fabrication Assembly
Micro Machining of Ultem 
Machined Ultem Components 
Ultem Machining 
30% Glass Filled Ultem Machining 
Ultem Machining 
Vapor Polishing, Ultem Machined Component 
Black Ultem Machining 
900 Precision Holes in Ultem 
Black Ultem Machined Component
Surgeon's Light has close tolerance helix for light tracking and focusing
Black ultem component turned complete on mill turn lathe. Helix profiled to meet +/- .001 tolerance throughout curve.
Black Ultem Machining 
Close Tolerance (+/- .0002) Ultem Machining 
Ultem Semiconductor Comb 
Machined Ultem
24'' sq machined ultem semiconductor component. Pockets within .003 true position. Special machining cycle and packaging procedures to maintain accuracy.
Ultem Multilayer Bonded Manifold
3 layer laminate manifold in Ultem for the semiconductor industry
Ultem multilayer fluidic bonded manifold
Bonded manifold for the semiconductor industry. No feature migration or feature collapse. Bond strength equal to the parent material for a high pressure application.
Chemically polished ultem cover the semiconductor industry
Polished semiconductor cover
To discuss the specifics of your Precision Plastic
Fabrication needs, please use either link below:
Email Us or
Online Inquiry Form
© 2012 CONNECTICUT PLASTICS
1264 Old Colony Rd., Wallingford, CT 06492
ph: 203-265-3299 | fax: 203-284-3328
Site by fastspot | Site Map