Connecticut Plastics: Precision
Plastic Fabricators

Annealing & Stress Relieving Parts Photos

Ultem machiningUltem machining

 

Stress cracking in root of fins. Poor surface finish blocks light transmitting through material.

Stress relieving of material and custom designed cutting tool eliminates machining stress. Clear finish accomplished through vapor polishing.


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Effects of stress in PolycarbonateEffects of stress in Polycarbonate

 

Instrument shield stress cracks in service.

Machine components while maintaining low stress levels. Final stress relieving cycle eliminates future stress cracking.


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PPS machinined componentsPPS machinined components

 

Washer requires heat treatment for 4 days at 600 degrees while maintaining flatness.

PPS Machined Component


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Effects of stress on PolysulfoneEffects of stress on Polysulfone

 

Component must be machined with low to no stress. Part requirements dictate a final stress test for lot acceptability.

Polysulfone is very susceptible to stress cracking over time. Annealing cycle after machining removes material and machining stress. Components pass final stress test 100% of the time.


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Vapor Polished PolycarbonateVapor Polished Polycarbonate

 

Sample of Vapor Polishing on a Polycarbonate component


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Polycarbonate Stress CrackingPolycarbonate Stress Cracking

 

Proper machining and stress reliving of a vapor polished polycarbonate part versus stress cracked polycarbonate component


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Polysulfone MachiningPolysulfone Machining

Polysulfone benefits from post machining stress relieving. Polysulfone is stress sensitive and unannealed components can fail in service from thermal and mechanical loading. Parts that are stabalized will survive 3 second submersion in acetone without failure.

 

Examples of Parts Machined in Polysulfone


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PPS MachiningPPS Machining

PPS material annealed for 4 days to improve performance in high end device application

 


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Stress lines in an acrylic manifold.

 


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Stress Analysis of Ultem ComponentStress Analysis of Ultem Component

Analysis of stress in an ultem component. Part used in the semiconductor industry.

 


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