Machined acrylic manifold
Customer has burr problem in intersection of small holes, blocking flow paths. Drills do not track straight.
Recommend switch to acrylic from PVC. Proper speeds and feeds for drilling improves hole finish. Specialty tooling allows straight holes for 30:1 diameter to depth ratio.
20% Glass filled Ultem
Material choice creates burr and flatness problems with given part configuration.
Annealing cycle coupled with milling process maintains flatness to customer specification. Proper end mill selection eliminates burring problem.
Clear acrylic machining
Finished projector lens requiring high quality finish. Cast acrylic choosen for its optical clarity and light transmittance.
Cast Acrylic Component
Flame Polished Acrylic Manifold
Cast Acrylic Manifold
Plastic manifold for use in a medical application.
Small clear acrylic manifold
Cast Acrylic, Polished
Polished Cast Acrylic Component
Vapor Polished Acrylic Manifolds
Various Acrylic Medical Components, Polished
Acrylic Components for a medical device
Medical Polished Acrylic Manifold
Acrylic Polished Manifold for a Medical Application
Delrin Medical Component
Black Delrin parts need close tolerancing with minimal burrs
Careful consideration for type and manufacturer of Delrin. Custom fixture for solid part support.
Precision Machined Plastic Medical Component
Electrophoresis Comb requires no burrs on well sites
Good machining practice combined with bead blast finish leaves consistent tooth profile
Polycarbonate Machining
Samples of Polycarbonate Machining
Medical Device Component, precision machined in polycarbonate.
PVC Machined Manifold
Clear PVC Manifold for Medical device. Lettering is engraved for port identification
Natural ultem machined component
Machined ultem semiconductor component, 2 ft sq. Pockets within .003 true position. Special machining cycle and packaging procedures to maintain accuracy.
Acrylic multilayer fluidic bonded manifold. Manifold has two layers bonded in a hermetically seamless fashion for a medical liquid control application.
3 layer laminate manifold in Ultem for the semiconductor industry
Multi Layer Fluidic Bonded Manifold for Semiconductor Industry
Bonded manifold for the semiconductor industry. No feature migration or feature collapse. Bond strength equal to the parent material for a high pressure application.